Combining Additive Manufacturing and Direct Write for Integrated Electronics – A Review

Direct write (DW) of conductive materials in the context of Additive Manufacturing (AM) enables embedded electronics within fabricated parts. Previous works use manual, hybrid, and native material patterning systems to deposit conductive materials in parts fabricated by different AM technologies. This capability could eliminate cabled interconnects and redundant electronics packaging, resulting in a significant reduction of mass and assembly complexity. In this paper, the authors explore applications of DW of conductive traces in the context of AM, review prior work in the integration, and analyze the technical roadblocks facing their hybridization. Barriers to integrating the two technology classes include material, process, and post-process compatibilities.