Browsing by Subject "integration"
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Item AMS :: ATX September 2011 Blog Archive(2011-09) Department of American StudiesAMS :: ATX is a blog dedicated to representing the many activities and interests of the department of American Studies at The University of Texas at Austin. Together with the department’s Twitter feed, this blog exists to serve the AMS and Austin communities by acting as a hub for up-to-date information on events and opportunities at UT and beyond. This archive includes the following blog posts: 12 Twitterers American Studies Folks Should Follow (September 1, 2011); Faculty Research: Radical Children's Literature Now! (September 7, 2011); 5 Questions with Department Chair Steven Hoelscher (September 8, 2011); 5 Maps for the Visually Inclined (September 14, 2011); Watch This: Bodega Down Bronx (September 16, 2011); AMS Events this Week (September 20, 2011); 5 Questions wiht Dr. Randy Lewis (September 21, 2011); Grad Research: War Documentaries and [Un]realism (September 27, 2011).Item A Case Study of Tibetan Medicine: Examining Challenges of Establishing the Credibility of Traditional Medical Systems(2021-05-11) Palkyi, Tenzin; Schnyer, RosaThe medical field is seeing a shift in healthcare delivery from a disease-centered model that focuses on curing acute illnesses to a more holistic approach which prioritizes overall well-being and preventive care. With this transition, there has been an increased interest in complementary and alternative medicine- (CAM) based interventions, leading to the emergence of the Complementary and Integrative Health (CIH) field. As CIH interventions like Tibetan medicine (TM) become more widely used, recent research is being conducted to determine these treatments’ potential effectiveness and to address skepticism about their relevance in health care. This thesis intends to explore TM as a case study of traditionally- based systems of care, which consider all aspects of a patient, including mental, physical, and social factors. Furthermore, this thesis will outline the evolution of TM from its inception through recent geo-political changes in addition to the global reach TM has had in Western societies. A non-systematic literature review was conducted to identify current studies available on TM’s effectiveness, explore gaps in TM research, and articulate challenges that traditional medical systems must overcome to further develop its evidence base. Some of these challenges include improving research quality, navigating inconsistent regulations of herbal compounds, and balancing the difficulty of conducting scientifically sound medical research without sacrificing the cultural integrity of non-biomedically based systems of care. Based on this analysis of Tibetan medicine, I propose recommendations that may serve to systematically integrate complementary medicine into future Western medical training. By addressing challenges with tangible solutions, traditional medical systems can further develop their evidence base, build credibility in Western societies, and be more accessible by being safely offered independently or together with allopathic medicine.Item Chemical Vapour Deposition of Amorphous Ru(P) Thin Films from Ru Trialkylphosphite Hydride Complexes(2012-09) McCarty, W. Jeffrey; Yang, Xiaoping; Anderson, Lauren J. D.; Jones, Richard A.; McCarty, W. Jeffrey; Yang, Xiaoping; Anderson, Lauren J. D.; Jones, Richard A.The ruthenium phosphite hydride complexes H2Ru(P(OR)(3))(4) (R = Me (1), Et (2), Pr-i (3)) were used as CVD precursors for the deposition of films of amorphous ruthenium-phosphorus alloys. The as-deposited films were X-ray amorphous and XPS analysis revealed that they were predominantly comprised of Ru and P in zero oxidation states. XPS analysis also showed the presence of small amounts of oxidized ruthenium and phosphorus. The composition of the films was found to depend on ligand chemistry as well as the deposition conditions. The use of H-2 as the carrier gas had the effect of increasing the relative concentrations of P and O for all films. Annealing films to 700 degrees C under vacuum produced films of polycrystalline hcp Ru while a flowing stream of H-2 resulted in polycrystalline hcp RuP.Item Comparison of Current Gravity Estimation and Determination Models(2018-05) Hillman, Kyle; Bettadpur, SrinivasThis paper will discuss the history of gravity estimation and determination models while analyzing methods that are in development. Some fundamental methods for calculating the gravity field include spherical harmonics solutions, local weighted interpolation, and global point mascon modeling (PMC). Recently, high accuracy measurements have become more accessible, and the requirements for high order geopotential modeling have become more stringent. Interest in irregular bodies, accurate models of the hydrological system, and on-board processing has demanded a comprehensive model that can quickly and accurately compute the geopotential with low memory costs. This trade study of current geopotential modeling techniques will reveal that each modeling technique has a unique use case. It is notable that the spherical harmonics model is relatively accurate but poses a cumbersome inversion problem. PMC and interpolation models, on the other hand, are computationally efficient, but require more research to become robust models with high levels of accuracy. Considerations of the trade study will suggest further research for the point mascon model. The PMC model should be improved through mascon refinement, direct solutions that stem from geodetic measurements, and further validation of the gravity gradient. Finally, the potential for each model to be implemented with parallel computation will be shown to lead to large improvements in computing time while reducing the memory cost for each technique.Item Equal But Separated: Desegregation Of Texarkana Public Schools(2019-05-01) Doan, Katherine Anne; Christian, GeorgeThis thesis examines the current demographics of Texas High School in Texarkana, U.S.A. and presents a historical narrative of school desegregation within the community to attempt to explain their composition. The historical narrative spans from the first lawsuit brought against Texarkana College’s system of segregation in 1952 to the public reaction to integration in the early 1970s, with a brief prelude explaining Texarkana’s history of slavery. This history was derived from school board meeting minutes, archived newspaper reports and interviews with students and teachers who experienced the transition firsthand. The conclusion finds that the legacy of school segregation must be considered a factor in the current racial composition of Advanced Placement courses.Item Looking Back and Pressing Forward: Lessons for Today Found in the Story of Barbara Smith Conrad(Texas Education Review, 2018-04-27) Stone, Ashley N.Item Political Agenda-Setting and Racial Integration in Public Schools: A Comparison of Denver Public Schools and New York City District 15(2021-12) Madhani, ShyamAlthough prior research has been done applying the Punctuated Equilibrium Theory (PET) and Multiple Streams Analysis (MSA) to political processes at the national or state level, no prior research has applied these theories on a local level specifically to racial and socio-economic integration plans in school districts. Interviews were conducted with key people in Denver Public Schools and New York District 15 in order to apply these theories to ascertain what the most relevant factors were that led to integration plans being approved in the respective school district. This study hypothesized that MSA would provide the most explanatory value when applied to these two school districts and that issue redefinition would be the most crucial factor leading to the approval of school integration plans. A deductive approach to qualitative analysis was used in order to analyze the interview data and connect the data to the theoretical frames of PET and MSA. This analysis revealed that while MSA had more explanatory value when applied to Denver’s integration plan, both MSA and PET had significant explanatory value when applied to New York City District 15’s plan. Overall, focusing events, issue redefinition, data availability, and long-standing community activism were all crucial factors in successfully creating and passing each integration plan.Item Stress-Induced Delamination Of Through Silicon Via Structures(2011-09) Ryu, S. K.; Lu, K. H.; Im, J.; Huang, R.; Ho, P. S.; Ryu, S. K.; Lu, K. H.; Im, J.; Huang, R.; Ho, P. S.Continuous scaling of on-chip wiring structures has brought significant challenges for materials and processes beyond the 32 nm technology node in microelectronics. Recently three-dimensional (3-D) integration with through-silicon-vias (TSVs) has emerged as an effective solution to meet the future interconnect requirement. Thermo-mechanical reliability is a key concern for the development of TSV structures used in die stacking as 3-D interconnects. This paper examines the effect of thermal stresses on interfacial reliability of TSV structures. First, the three-dimensional distribution of the thermal stress near the TSV and the wafer surface is analyzed. Using a linear superposition method, a semi-analytic solution is developed for a simplified structure consisting of a single TSV embedded in a silicon (Si) wafer. The solution is verified for relatively thick wafers by comparing to numerical results obtained by finite element analysis (FEA). Results from the stress analysis suggest interfacial delamination as a potential failure mechanism for the TSV structure. Analytical solutions for various TSV designs are then obtained for the steady-state energy release rate as an upper bound for the interfacial fracture driving force, while the effect of crack length is evaluated numerically by FEA. Based on these results, the effects of TSV designs and via material properties on the interfacial reliability are elucidated. Finally, potential failure mechanisms for TSV pop-up due to interfacial fracture are discussed.Item Thermomechanical Reliability Challenges For 3D Interconnects With Through-Silicon Vias(2010-06) Ryu, S. K.; Lu, K. H.; Zhang, X. F.; Im, J.; Ho, P. S.; Huang, R.; Ryu, S. K.; Lu, K. H.; Zhang, X. F.; Im, J.; Ho, P. S.; Huang, R.Continual scaling of on-chip wiring structures has brought significant challenges for materials and processes beyond the 32 nm technology node in microelectronics. Recently threedimensional (3-D) integration with through-silicon-vias (TSVs) has emerged as an effective solution to meet the future interconnect requirement. Among others, thermo-mechanical reliability is a key concern for the development of TSV structures used in die stacking as 3-D interconnects. This paper examines the effects of thermally induced stresses on interfacial reliability of TSV structures. First, three-dimensional distribution of the thermal stress near the TSV and the wafer surface is analyzed. Using a linear superposition method, a semi-analytic solution is developed for a simplified structure consisting of a single TSV embedded in a silicon (Si) wafer. The solution is verified for relatively thick wafers by comparing to numerical results From finite element analysis (FEA). The stress analysis suggests interfacial delamination as a potential failure mechanism for the TSV structure. An analytical solution is then obtained for the steady-state energy release rate as the upper bound for the interfacial fracture driving force, while the effect of crack length is evaluated numerically by FEA. With these results, the effects of the TSV dimensions (e.g., via diameter and wafer thickness) on the interfacial reliability are elucidated. Furthermore, the effects of via material properties are discussed.