Fiber Encapsulation Additive Manufacturing: Materials for Electrical Junction Fabrication

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dc.creatorXia, B.
dc.creatorSaari, M.
dc.creatorCox, B.
dc.creatorRicher, E.
dc.creatorKrueger, P.S.
dc.creatorCohen, A.L.
dc.date.accessioned2021-10-28T19:35:20Z
dc.date.available2021-10-28T19:35:20Z
dc.date.issued2016
dc.description.abstractFiber Encapsulation Additive Manufacturing (FEAM) is a novel 3-D printing process that permits the printing of electromechanical and electronic devices within a single, affordable machine. A key challenge of FEAM is creating robust and reliable electrical junctions between encapsulated wires, enabling more complex devices and circuits to be fabricated. We present current efforts to explore and characterize several different methods for creating junctions: solder, solder paste, and a custom-formulated electrically conductive polymer composite. All three methods are analyzed in terms of printability, material compatibility, repeatability, and performance.en_US
dc.description.departmentMechanical Engineeringen_US
dc.identifier.urihttps://hdl.handle.net/2152/89678
dc.language.isoengen_US
dc.publisherUniversity of Texas at Austinen_US
dc.relation.ispartof2016 International Solid Freeform Fabrication Symposiumen_US
dc.rights.restrictionOpenen_US
dc.subjectFiber Encapsulation Additive Manufacturingen_US
dc.subjectelectrical junctionsen_US
dc.subjectmaterial fabricationen_US
dc.titleFiber Encapsulation Additive Manufacturing: Materials for Electrical Junction Fabricationen_US
dc.typeConference paperen_US

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2016 International Solid Freeform Fabrication Symposium