System, method and apparatus for improved electrical-to-optical transmitters disposed within printed circuit boards

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dc.contributor.assigneeBoard of Regents, The University of Texas System
dc.creatorRay T. Chen
dc.creatorChulchae Chol
dc.date.accessioned2019-10-23T19:26:36Z
dc.date.available2019-10-23T19:26:36Z
dc.date.filed2004-07-07
dc.date.issued2006-09-26
dc.description.abstractThe present invention provides a system, method and apparatus for improved electrical-to-optical transmitters (100) disposed within printed circuit boards (104). The heat sink (110, 200) is a thermal conductive material disposed within a cavity (102) of the printed circuit board (104) and is thermally coupled to a bottom surface (112) of the electrical-to-optical transmitter (100). A portion of the thermal conductive material extends approximately to an outer surface (120, 122 or 124) of a layer (114, 116 or 118) of the printed circuit board (104). The printed circuit board may comprise a planarized signal communications system or an optoelectronic signal communications system. In addition, the present invention provides a method for fabricating the heat sink wherein the electrical-to-optical transmitter disposed within a cavity of the printed circuit board is fabricated. New methods for flexible waveguides and micro-mirror couplers are also provided.
dc.description.departmentBoard of Regents, University of Texas System
dc.identifier.applicationnumber10888350
dc.identifier.patentnumber7112885
dc.identifier.urihttps://hdl.handle.net/2152/76855
dc.identifier.urihttp://dx.doi.org/10.26153/tsw/3944
dc.publisherUnited States Patent and Trademark Office
dc.relation.ispartofUniversity of Texas Patents
dc.relation.ispartofUniversity of Texas Patents
dc.rights.restrictionOpen
dc.rights.restrictionOpen
dc.subject.cpcG02B6/4214
dc.subject.cpcG02B6/43
dc.subject.cpcH05K1/0274
dc.subject.cpcH05K1/0203
dc.subject.uspc257/728
dc.subject.uspc257/722
dc.subject.uspc372/9
dc.subject.uspc372/36
dc.titleSystem, method and apparatus for improved electrical-to-optical transmitters disposed within printed circuit boards
dc.typePatent

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