Stereolithography Cure Process Modeling Using Acrylate Resin

In this paper, a complex stereolithography (SL) cure process model is presented that incorporates transient thermal and chemical effects which influence final part shape and properties. The model incorporates photopolymerization, mass diffusion, and heat transfer. Material properties are characterized and a comprehensive kinetic model parameterized for a model compound system. SL process simulations are performed using finite element methods with the software package FEMLAB, and validated by the capability of predicting the fabricated part dimensions. A degree of cure (DOC) threshold model is proposed which can predict the cure line size within 15% error, comparing with 30% prediction error by the exposure threshold model currently used in SL. Furthermore, through the sensitivity analysis conducted by the process model presented here, the sensitive parameters are identified and the SL bath temperature, photointiator absorptivity and concentration are found to be the most sensitive factors that affect the SL fabrication results. The sensitive variables will be the focus of further research meant to improve SL process speed and resolution.