Selective laser sintering with assisted powder handling

dc.contributor.assigneeBoard of Regents, The University of Texas System
dc.creatorCarl R. Deckard
dc.creatorJoseph J. Beaman, Jr.
dc.date.accessioned2019-10-23T21:44:45Z
dc.date.available2019-10-23T21:44:45Z
dc.date.filed1989-09-05
dc.date.issued1990-07-03
dc.description.abstractA method and apparatus for selectively sintering a layer of powder to produce a part comprising a plurality of sintered layers. The apparatus includes a computer controlling a laser to direct the laser energy onto the powder to produce a sintered mass. The computer either determines or is programmed with the boundaries of the desired cross-sectional regions of the part. For each cross-section, the aim of the laser beam is scanned over a layer of powder and the beam is switched on to sinter only the powder within the boundaries of the cross-section. Powder is applied and successive layers sintered until a completed part is formed. Preferably, the powder is deposited to the target area of the laser and attains high bulk density during sintering.
dc.description.departmentBoard of Regents, University of Texas System
dc.identifier.applicationnumber7402693
dc.identifier.patentnumber4938816
dc.identifier.urihttps://hdl.handle.net/2152/77339
dc.identifier.urihttp://dx.doi.org/10.26153/tsw/4428
dc.publisherUnited States Patent and Trademark Office
dc.relation.ispartofUniversity of Texas Patents
dc.relation.ispartofUniversity of Texas Patents
dc.rights.restrictionOpen
dc.rights.restrictionOpen
dc.subject.cpcB05C19/008
dc.subject.cpcB05C19/00
dc.subject.cpcB22F3/004
dc.subject.cpcB22F3/105
dc.subject.cpcB22F3/1055
dc.subject.cpcB22F7/02
dc.subject.cpcB22F2003/1052
dc.subject.cpcB22F2003/1056
dc.subject.cpcB22F2998/00
dc.subject.cpcB22F2998/10
dc.subject.cpcB22F3/26
dc.subject.cpcB23K26/08
dc.subject.cpcB23K26/082
dc.subject.cpcB23K26/34
dc.subject.cpcB29C41/12
dc.subject.cpcB29C41/46
dc.subject.cpcB29C64/153
dc.subject.cpcB29C35/045
dc.subject.cpcB33Y10/00
dc.subject.cpcB33Y30/00
dc.subject.cpcC23C26/02
dc.subject.cpcC23C24/08
dc.subject.cpcC23C24/10
dc.subject.cpcG05B2219/49013
dc.subject.cpcG05B2219/49018
dc.subject.cpcY02P10/295
dc.subject.cpcY02P90/265
dc.subject.uspc156/62.2
dc.subject.uspc156/272.4
dc.subject.uspc156/272.8
dc.subject.uspc219/121.66
dc.subject.uspc219/121.8
dc.subject.uspc219/121.85
dc.subject.uspc264/113
dc.subject.uspc264/125
dc.subject.uspc264/429
dc.subject.uspc264/435
dc.subject.uspc264/497
dc.subject.uspc264/642
dc.subject.uspc425/174
dc.titleSelective laser sintering with assisted powder handling
dc.typePatent

Access full-text files

Original bundle

Now showing 1 - 1 of 1
Loading...
Thumbnail Image
Name:
US4938816.pdf
Size:
1.66 MB
Format:
Adobe Portable Document Format