High Viscosity Jetting of Conductive and Dielectric Pastes for Printed Electronics

Ink-jet printing of multiple materials in 3 dimensions is a promising alternative to traditional patterning methods due to its flexibility, scalability and accuracy. However, the printability of the inks is strongly restricted by material properties such as surface tension and viscosity. Dispensing high viscosity fluids on a drop-on-demand approach is a potential solution that can facilitate the incorporation of new materials to the jetting catalogue. Consequently, in this study 2 micro-dispensing valves are used in combination with a mechanical stage to deposit conductive and dielectric pastes with viscosities of 15.3 ± 0.2 and 0.638 ± 0.005 Pa·s (at 25°C and 10 s-1 shear rate) respectively. Crucial printing parameters such as pressure, temperature, pulse shape and drop spacing are studied in order to optimise the process. Additionally, post-printing characteristics such as contact angle of different materials and cured layer profiles are also measured and taken into account during the designing of the 3D patterns to minimise the negative effects of the thickness miss-match of different materials. Finally, the manufacturing capability of the set-up is demonstrated by the fabrication of a functional device using a combination of “pick-and-place” components and high viscosity jetting.