Rotational 3D Printing of Sensor Devices using Reactive Ink Chemistries

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Hauser, C.
Lewis, D. M.
Morris, K. F.
Broadbent, P. J
Zhao, X.
Clare, A. T.
Dunschen, M.

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This paper charts progress in three key areas of a project supported by both UK government and UK industry to manufacture novel sensor devices using rotary 3D printing technology and innovative ink chemistries; (1) the development of an STL file slicing algorithm that returns constant Z height 2D contour data at a resolution that matches the given print head setup, allowing digital images to be generated of the correct size without the need for scaling; (2) the development of image transformation algorithms which allow images to be printed at higher resolutions using tilted print heads and; (3) the formulation of multi part reaction inks which combine and react on the substrate to form solid material layers with a finite thickness. A Direct Light Projection (DLP) technique demonstrated the robustness of the slice data by constructing fine detailed three dimensional test pieces which were comparable to identical parts built in an identical way from slice data obtained using commercial software. Material systems currently under investigation include plaster, stiff polyamides and epoxy polymers and conductive metallic’s. Early experimental results show conductivities of silver approaching 1.42x105 Siemens/m.


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