Process Modeling and In-Situ Monitoring of Photopolymerization for Exposure Controlled Projection Lithography (ECPL)

dc.creatorWang, J.
dc.creatorZhao, C.
dc.creatorZhang, Y.
dc.creatorJariwala, A.
dc.creatorRosen, D.
dc.date.accessioned2021-11-04T14:56:55Z
dc.date.available2021-11-04T14:56:55Z
dc.date.issued2017
dc.description.abstractExposure controlled projection lithography (ECPL) is an additive manufacturing process in which photopolymer resin is used to fabricate three-dimensional features. During this process, UV curing radiation, controlled by a dynamic mask, is projected through a transparent substrate onto the resin. COMSOL software has been used to model the photopolymerization reaction kinetics, predicting the cured part geometry based on certain process parameters. Additionally, an Interferometric Curing Monitoring (ICM) system has been implemented to acquire real-time information about the optical properties of the cured part. Potential sources of error with the real-time monitoring system were investigated. Additionally, refractive index and degree of conversion changes were modeled throughout the reaction. Measured and simulated results were compared to understand the ICM signal with the reaction kinetics. These comparisons were used to validate the simulation model and identify system level errors that must be reconciled to improve the accuracy and precision of the ECPL process.en_US
dc.description.departmentMechanical Engineeringen_US
dc.identifier.urihttps://hdl.handle.net/2152/89977
dc.language.isoengen_US
dc.publisherUniversity of Texas at Austinen_US
dc.relation.ispartof2017 International Solid Freeform Fabrication Symposiumen_US
dc.rights.restrictionOpenen_US
dc.subjectexposure controlled projection lithographyen_US
dc.subjectECPLen_US
dc.subjectphotopolymerizationen_US
dc.subjectprocess modelingen_US
dc.subjectin-situ monitoringen_US
dc.subjectreal-timeen_US
dc.titleProcess Modeling and In-Situ Monitoring of Photopolymerization for Exposure Controlled Projection Lithography (ECPL)en_US
dc.typeConference paperen_US

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