Real-Time Process Measurement and Feedback Control for Exposure Controlled Projection Lithography

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dc.creatorZhao, Xiayun
dc.creatorRosen, David W.
dc.date.accessioned2021-11-02T20:03:28Z
dc.date.available2021-11-02T20:03:28Z
dc.date.issued2017
dc.description.abstractThe Exposure Controlled Projection Lithography (ECPL) is an additive manufacturing process that can cure microscale photopolymer parts on a stationary substrate with patterned ultraviolet beams underneath. An in-situ interferometric curing monitoring and measuring (ICM&M) system is developed to measure the ECPL process output of cured height profile. This study develops a real-time feedback control system that utilizes the online ICM&M feedback for automatically and accurately cure a part of targeted height. The experimental results directly validate the ICM&M system’s real-time capability in capturing the process dynamics and in sensing the process output, and evidently demonstrate the feedback control system’s satisfactory performance in achieving the desired height despite the presence of ECPL process uncertainties, ICM&M noises, and computing interruptions. A comprehensive error analysis is reported, implying a promising submicron control with enhanced hardware. Generally, the study establishes a paradigm of improving additive manufacturing with a real-time closed-loop measurement and control system.en_US
dc.description.departmentMechanical Engineeringen_US
dc.identifier.urihttps://hdl.handle.net/2152/89882
dc.language.isoengen_US
dc.publisherUniversity of Texas at Austinen_US
dc.relation.ispartof2017 International Solid Freeform Fabrication Symposiumen_US
dc.rights.restrictionOpenen_US
dc.subjectfeedback controlen_US
dc.subjectreal-timeen_US
dc.subjectin-situen_US
dc.subjectinterferometric curing monitoring and measuringen_US
dc.subjectexposure controlled projection lithographyen_US
dc.titleReal-Time Process Measurement and Feedback Control for Exposure Controlled Projection Lithographyen_US
dc.typeConference paperen_US

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