Quantifying Dimensional Accuracy of a Mask Projection Micro Stereolithography System

dc.creatorLimaye, Ameya
dc.creatorRosen, David
dc.date.accessioned2020-02-14T15:51:43Z
dc.date.available2020-02-14T15:51:43Z
dc.date.issued2004-09-01
dc.description.abstractMask Projection Microstereolithography is capable for fabricating true three-dimensional microparts and hence, holds promise as a potential micro-fabrication process for micro-machine components. In this paper, the Mask Projection Micro-Stereolithography (MPµSLA) system developed at the Rapid Prototyping and Manufacturing Institute at Georgia Institute of Technology is presented. The dimensional accuracy of the system is improved by reducing its process planning errors. To this effect, the MPµSLA process is mathematically modeled. In this paper, the irradiance received by the resin surface is modeled as a function of the imaging system parameters and the pattern displayed on the dynamic mask. The resin used in the system is characterized to experimentally determine its working curve. This work enables us to compute the dimensions of a single layer cured using our system. The analytical model is validated by curing test layers on the system. The model computes layer dimensions within 5% error.en_US
dc.description.departmentMechanical Engineeringen_US
dc.identifier.urihttps://hdl.handle.net/2152/79989
dc.identifier.urihttp://dx.doi.org/10.26153/tsw/7014
dc.language.isoengen_US
dc.relation.ispartof2004 International Solid Freeform Fabrication Symposiumen_US
dc.rights.restrictionOpenen_US
dc.subjectMask Projection Microstereolithographyen_US
dc.titleQuantifying Dimensional Accuracy of a Mask Projection Micro Stereolithography Systemen_US
dc.typeConference paperen_US

Access full-text files

Original bundle

Now showing 1 - 1 of 1
Loading...
Thumbnail Image
Name:
2004-48-Limaye.pdf
Size:
955.84 KB
Format:
Adobe Portable Document Format
Description:

License bundle

Now showing 1 - 1 of 1
No Thumbnail Available
Name:
license.txt
Size:
1.64 KB
Format:
Item-specific license agreed upon to submission
Description: