Support-free sintering of 3D printed binder jet copper and stainless steel parts
dc.creator | Jangam, John Samuel Dilip | |
dc.creator | Anthony, Thomas | |
dc.creator | McKinnell, Jim | |
dc.creator | Pon, Ben | |
dc.creator | Piderman, Jake | |
dc.creator | Zhao, Lihua | |
dc.date.accessioned | 2023-01-31T13:56:33Z | |
dc.date.available | 2023-01-31T13:56:33Z | |
dc.date.issued | 2022 | |
dc.description.abstract | Binder jet additive manufacturing involves selectively applying a binder, layer-by-layer, to produce green parts, followed by a high temperature sintering treatment. During sintering, green parts are inherently prone to undesired part distortion/sag in the unsupported regions. Traditional methods use 3D printed supports or machined ceramic setters to avoid the part distortion/sag during sintering. We introduce a shape-retaining-stimulus coating that will mitigate/eliminate the need of additional supports during sintering. Simply supported coper and stainless steel green parts of various thickness were evaluated for part distortion. Our experimental results demonstrate that a selective application of the shape-retaining-stimulus coating on 3D printed copper parts with a spanning up to 50 mm, and stainless steel parts spanning up to 33 mm can be sintered without auxiliary supports. Our shape-retaining-stimulus coating produces exceptional results, and the ease of removal makes it an attractive candidate. | en_US |
dc.description.department | Mechanical Engineering | en_US |
dc.identifier.uri | https://hdl.handle.net/2152/117367 | |
dc.identifier.uri | http://dx.doi.org/10.26153/tsw/44248 | |
dc.language.iso | eng | en_US |
dc.relation.ispartof | 2022 International Solid Freeform Fabrication Symposium | en_US |
dc.rights.restriction | Open | en_US |
dc.subject | Binder jetting | en_US |
dc.subject | sintering | en_US |
dc.subject | support structures | en_US |
dc.subject | distortion | en_US |
dc.title | Support-free sintering of 3D printed binder jet copper and stainless steel parts | en_US |
dc.type | Conference paper | en_US |
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