Process Planning Method for Exposure Controlled Projection Lithography

dc.creatorJariwala, Amit S.
dc.creatorJones, Harrison
dc.creatorKwatra, Abhishek
dc.creatorRosen, David W.
dc.date.accessioned2021-10-07T15:35:45Z
dc.date.available2021-10-07T15:35:45Z
dc.date.issued2013
dc.description.abstractAn Exposure Controlled Projection Lithography (ECPL) process with the ability to cure lens shaped structures on transparent substrates is presented. This process can be used to create microlenses and micro fluidic channels on flat or curved substrates. Incident radiation, patterned by a dynamic mask, passes through a transparent substrate to cure photopolymer resin that grows progressively from the substrate surface. A resin response model which incorporates the effects of oxygen inhibition during photopolymerization is used to formulate a process planning method for ECPL. This process planning method is validated for fabricating lens shaped structure on flat transparent substrates using the ECPL system.en_US
dc.description.departmentMechanical Engineeringen_US
dc.identifier.urihttps://hdl.handle.net/2152/88483
dc.identifier.urihttp://dx.doi.org/10.26153/tsw/15417
dc.language.isoengen_US
dc.publisherUniversity of Texas at Austinen_US
dc.relation.ispartof2013 International Solid Freeform Fabrication Symposiumen_US
dc.rights.restrictionOpenen_US
dc.subjectExposure Controlled Projection Lithographyen_US
dc.subjectprocess planningen_US
dc.subjectlens shaped structureen_US
dc.subjectflat transparent substratesen_US
dc.titleProcess Planning Method for Exposure Controlled Projection Lithographyen_US
dc.typeConference paperen_US
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