Process Planning Method for Exposure Controlled Projection Lithography
An Exposure Controlled Projection Lithography (ECPL) process with the ability to cure lens shaped structures on transparent substrates is presented. This process can be used to create microlenses and micro fluidic channels on flat or curved substrates. Incident radiation, patterned by a dynamic mask, passes through a transparent substrate to cure photopolymer resin that grows progressively from the substrate surface. A resin response model which incorporates the effects of oxygen inhibition during photopolymerization is used to formulate a process planning method for ECPL. This process planning method is validated for fabricating lens shaped structure on flat transparent substrates using the ECPL system.