Embedding of SMD Populated Circuits into FDM Printed Objects

dc.creatorWasserfall, Florens
dc.date.accessioned2021-10-19T18:21:52Z
dc.date.available2021-10-19T18:21:52Z
dc.date.issued2015
dc.description.abstractThis paper introduces the concept of a highly integrated 3D-printing device which is capable of printing plastic parts with integrated, fully assembled electronic circuits in a single process. It is based on a standard FDM 3D-printer that has been augmented by a screw-driven conductive paste extruder for electronic circuit printing, a vacuum nozzle to pick and place SMD-components and a vision system to find and precisely align the components before placing. To control the printer, an existing host software system has been extended to synchronize the communication with the printer for interactive operations and to generate the required movements from camera data by means of image processing. A number of objects, containing circuits on both the surface and inside of the object, has been successfully printed already. Quality and durability of the generated parts have been evaluated by analyzing the curing characteristics of the conductive ink during the process and the adhesion of the components which are placed directly on the wet ink. The design concept aims for a practical, affordable approach that can be widely used by developers to lower the entrance barrier to the field of 3D-printed electronics. Hence, the hardware is kept as simple as possible, avoiding complex and expensive components as laser or CNC-milling devices, focusing on algorithmic improvements in the preprocessing and control software. All developed hard- and software-components are available under open source licenses and compatible to common existing projects.en_US
dc.description.departmentMechanical Engineeringen_US
dc.identifier.urihttps://hdl.handle.net/2152/89317
dc.language.isoengen_US
dc.publisherUniversity of Texas at Austinen_US
dc.relation.ispartof2014 International Solid Freeform Fabrication Symposiumen_US
dc.rights.restrictionOpenen_US
dc.subject3D printingen_US
dc.subjectfused deposition modelingen_US
dc.subjectelectronic circuitsen_US
dc.subjectSMD-componentsen_US
dc.titleEmbedding of SMD Populated Circuits into FDM Printed Objectsen_US
dc.typeConference paperen_US

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