Thermal analysis of surface mounted chip components during reflow soldering using finite element analysis

Simple item page
dc.contributor.advisorMasada, Glenn Y.
dc.creatorGoh, Robert Teck Lee, 1956-
dc.date.accessioned2023-08-03T22:28:49Z
dc.date.available2023-08-03T22:28:49Z
dc.date.issued1988
dc.description.abstractIn surface mount technology, electronic components are soldered directly onto printed wiring boards without having to insert the component leads into the board. This arrangement results in higher functional density boards with improved performance. Surface mounted chip components have the problem that they tend to move during the reflow soldering process. To get an better understanding of the reflow process and the problem of chip movement during reflow, a thermal analysis of type 1206 chip resistors and capacitors was performed using the NASTRAN finite element program. The analysis provided temperature profiles in the models resulting from different kinds of heat inputs. Also, the sensitivity of the temperature profiles to several model parameters was studied. The study found that Infrared reflow soldering produces a temperature profile that is less likely to produce chip movement during reflow. The study also showed how the thermal behavior of electronic components during reflow can be predicted using finite element softwareen_US
dc.description.departmentMechanical Engineeringen_US
dc.format.mediumelectronicen_US
dc.identifier.urihttps://hdl.handle.net/2152/120738
dc.identifier.urihttp://dx.doi.org/10.26153/tsw/47571
dc.language.isoengen_US
dc.relation.ispartofUT Electronic Theses and Dissertationsen_US
dc.rightsCopyright © is held by the author. Presentation of this material on the Libraries' web site by University Libraries, The University of Texas at Austin was made possible under a limited license grant from the author who has retained all copyrights in the works.en_US
dc.rights.restrictionRestricteden_US
dc.subjectSurface mount technologyen_US
dc.subjectIntegrated circuitsen_US
dc.subjectSolderingen_US
dc.subjectThermal analysisen_US
dc.subjectFinite element methoden_US
dc.subjectChip componentsen_US
dc.subjectReflowen_US
dc.subjectElectronic componentsen_US
dc.subject.lcshSurface mount technology
dc.subject.lcshIntegrated circuits
dc.subject.lcshSolder and soldering
dc.subject.lcshThermal analysis
dc.subject.lcshFinite element method
dc.titleThermal analysis of surface mounted chip components during reflow soldering using finite element analysisen_US
dc.typeThesisen_US
dc.type.genreThesisen_US
thesis.degree.departmentMechanical Engineeringen_US
thesis.degree.disciplineMechanical Engineeringen_US
thesis.degree.grantorUniversity of Texas at Austinen_US
thesis.degree.levelMastersen_US
thesis.degree.nameMaster of Science in Engineeringen_US

Access full-text files

Original bundle

Now showing 1 - 2 of 2
No Thumbnail Available
Name:
txu-oclc-20032883.pdf
Size:
58.69 MB
Format:
Adobe Portable Document Format
Description:
Final pdf File Access restricted to UT Austin EID holders
Download
No Thumbnail Available
Name:
txu-oclc-20032883-TEXT.txt
Size:
96.45 KB
Format:
Plain Text
Description:
XML Text File Access restricted to UT Austin EID holders
Download

License bundle

Now showing 1 - 1 of 1
No Thumbnail Available
Name:
license.txt
Size:
1.64 KB
Format:
Item-specific license agreed upon to submission
Description:
Download

Collections

UT Electronic Theses and Dissertations