Mapping Core and L3 Slice Numbering to Die Location in Intel Xeon Scalable Processors

Date

2021-02-28

Authors

McCalpin, John

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Abstract

A methodology for mapping from user-visible core and L3 slice numbers to locations on the processor die is presented, along with results obtained from systems with Intel Xeon Scalable Processors (“Skylake Xeon” and “Cascade Lake Xeon”) at the Texas Advanced Computing Center. The current methodology is based on the data traffic counters in the 2-D mesh on-chip-network, with the measurements revealing unexpected and counterintuitive transformations of the meanings of “left” and “right” in different regions of the chip. Results show that the numbering of L3 slices is consistent across processor models, while the numbering of cores displays a small number of different patterns, depending on processor model and system vendor.

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