Real Time Monitoring of Exposure Controlled Projection Lithography with Time-Varying Scanning Points

dc.creatorZhao, Changxuan
dc.creatorJariwala, Amit S.
dc.creatorRosen, David W.
dc.date.accessioned2021-10-28T15:17:24Z
dc.date.available2021-10-28T15:17:24Z
dc.date.issued2016
dc.description.abstractExposure Controlled Projection Lithography (ECPL) is a stereolithographic process in which photopolymer resin is used to fabricate lens shaped features. During this process, a dynamic mask projects radiation patterns through a transparent substrate onto the photopolymer resin to grow features from the substrate surface. We present a novel method to monitor the photopolymerization process in real-time with higher spatial resolution in a plane perpendicular to the polymerization growth. A Spatial Light Modulator (SLM) was incorporated into our Interferometric Cure Monitoring (ICM) system, which periodically moves the positions of the scanning points onto the curing area to estimate the cured part height. This time-varying scanning strategy avoids interference caused by points too close to one another and enables higher spatial resolution than fixed scan patterns. This time-varying multi-point monitoring approach is experimentally validated to measure the cured part height and the lateral dimensions of the cured part at the substrate level.en_US
dc.description.departmentMechanical Engineeringen_US
dc.identifier.urihttps://hdl.handle.net/2152/89661
dc.language.isoengen_US
dc.publisherUniversity of Texas at Austinen_US
dc.relation.ispartof2016 International Solid Freeform Fabrication Symposiumen_US
dc.rights.restrictionOpenen_US
dc.subjectphotopoymerizationen_US
dc.subjectscanning pointsen_US
dc.subjectreal-time monitoringen_US
dc.subjectexposure controlled projection lithographyen_US
dc.titleReal Time Monitoring of Exposure Controlled Projection Lithography with Time-Varying Scanning Pointsen_US
dc.typeConference paperen_US

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