Numerical Thermal Analysis in Electron Beam Additive Manufacturing with Preheating Effects
dc.creator | Shen, Ninggang | |
dc.creator | Chou, Kevin | |
dc.date.accessioned | 2021-10-06T21:33:55Z | |
dc.date.available | 2021-10-06T21:33:55Z | |
dc.date.issued | 2012-08-16 | |
dc.description.abstract | In an early study, a thermal model has been developed, using finite element simulations, to study the temperature field and response in the electron beam additive manufacturing (EBAM) process, with an ability to simulate single pass scanning only. In this study, an investigation was focused on the initial thermal conditions, redesigned to analyze a critical substrate thickness, above which the preheating temperature penetration will not be affected. Extended studies are also conducted on more complex process configurations, such as multi-layer raster scanning, which are close to actual operations, for more accurate representations of the transient thermal phenomenon. | en_US |
dc.description.department | Mechanical Engineering | en_US |
dc.identifier.uri | https://hdl.handle.net/2152/88451 | |
dc.identifier.uri | http://dx.doi.org/10.26153/tsw/15388 | |
dc.language.iso | eng | en_US |
dc.publisher | University of Texas at Austin | en_US |
dc.relation.ispartof | 2012 International Solid Freeform Fabrication Symposium | en_US |
dc.rights.restriction | Open | en_US |
dc.subject | electron beam additive manufacturing | en_US |
dc.subject | thermal models | en_US |
dc.subject | preheating temperatures | en_US |
dc.subject | complex process configurations | en_US |
dc.subject | temperature field | en_US |
dc.title | Numerical Thermal Analysis in Electron Beam Additive Manufacturing with Preheating Effects | en_US |
dc.type | Conference paper | en_US |