Direct-Write Fabrication of Integrated, Multilayer Ceramic Components

dc.creatorDimos, D.
dc.creatorYang, P.
dc.creatorGarino, TJ.
dc.creatorRaymond, M.V.
dc.creatorRodriguez, M.A.
dc.date.accessioned2018-11-28T17:35:57Z
dc.date.available2018-11-28T17:35:57Z
dc.date.issued1997
dc.description.abstractThe need for advanced (electronic) ceramic components with smaller size, greater functionality, and enhanced reliability requires the ability to integrate electronic ceramics in complex 3-D architectures. For rapid prototyping and small-lot manufacturing, traditional tape casting and screen printing approaches are poorly suited. To address this need, we are developing a direct-write approach for fabricating highly integrated, multilayer components using a micropen to deposit slurries in precise patterns. With this technique, components can be constructed layer by layer, simplifying fabrication. It can also be used to produce structures combining several materials in a single layer. The parts are either cofired or sequentially fired, after each layer is deposited. Since differential shrinkage can lead to defects in these multilayer structures, we are characterizing the sintering behavior ofindividua1layers. This technique has been used to fabricate devices such integrated RC filters, multilayer voltage transformers, and other passive components. The direct-write approach provides the ability to fabricate multifunctional, multimaterial integrated ceramic components (MMICCs) in an agile and rapid way.en_US
dc.description.departmentMechanical Engineeringen_US
dc.identifierdoi:10.15781/T2BN9XP08
dc.identifier.urihttp://hdl.handle.net/2152/70323
dc.language.isoengen_US
dc.relation.ispartof1997 International Solid Freeform Fabrication Symposiumen_US
dc.rights.restrictionOpenen_US
dc.subjectHigh reliabilityen_US
dc.subject3-D architecturesen_US
dc.subjectfabrication processesen_US
dc.titleDirect-Write Fabrication of Integrated, Multilayer Ceramic Componentsen_US
dc.typeConference paperen_US

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