Electronics Integration in Conformal Substrates Fabricated with Additive Layered Manufacturing

dc.creatorCastillo, Sylvia
dc.creatorMuse, Dan
dc.creatorMedina, Frank
dc.creatorMacDonald, Eric
dc.creatorWicker, Ryan
dc.date.accessioned2021-09-29T18:10:24Z
dc.date.available2021-09-29T18:10:24Z
dc.date.issued2009-09
dc.description.abstractA three-dimensional (3D) accelerometer sensor system with microprocessor control was fabricated using a previously developed integrated layered manufacturing system that combines conductive ink dispensing with stereolithography (SL). The electronics are integrated into a conformal substrate that is press-fit into a helmet for the purpose of detecting Traumatic Head Injury (THI) when an excessive acceleration to the head is measured. Applications include monitoring the health of soldiers or athletes. Traditional fabrication of electronics is implemented with a 2 dimensional printed circuit board (PCB), which are not well suited for rugged installations in curved locations such as the interior of a helmet. The advantage of layered manufacturing for the integration of electronics is the ability to fabricate in a conformal substrate - conforming to the curved, complex, and often flexible shapes dictated by the human body.en_US
dc.description.departmentMechanical Engineeringen_US
dc.identifier.urihttps://hdl.handle.net/2152/88205
dc.identifier.urihttp://dx.doi.org/10.26153/tsw/15146
dc.language.isoengen_US
dc.publisherUniversity of Texas at Austinen_US
dc.relation.ispartof2009 International Solid Freeform Fabrication Symposiumen_US
dc.rights.restrictionOpenen_US
dc.subjectrapid prototypingen_US
dc.subjectstereolithographyen_US
dc.subjectdirect-printen_US
dc.subjecthybrid manufacturingen_US
dc.subjectconformal electronicsen_US
dc.subjectaccelerometeren_US
dc.subjectthree-dimensional electronicsen_US
dc.titleElectronics Integration in Conformal Substrates Fabricated with Additive Layered Manufacturingen_US
dc.typeConference paperen_US

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