Non-Destructive Evaluation of Additively Manufactured Parts via Impedance-Based Monitoring

dc.creatorAlbakri, Mohammed
dc.creatorSturm, Logan
dc.creatorWilliams, Christopher B.
dc.creatorTarazaga, Pablo
dc.date.accessioned2021-10-21T19:42:10Z
dc.date.available2021-10-21T19:42:10Z
dc.date.issued2015
dc.description.abstractThe ability of Additive Manufacturing (AM) processes to fabricate complex geometries is somewhat hindered by an inability to effectively validate the quality of printed complex parts. Furthermore, there are classes of part defects that are unique to AM that cannot be efficiently measured with standard Quality Control (QC) techniques (e.g., internal porosity). Current QC methods for AM are limited to either destructive evaluation of printed test coupons, or expensive radiation-based scanners of printed parts for non-destructive evaluation. In this paper, the authors describe their use of impedance-based structural monitoring to indirectly measure printed part abnormalities. By bonding a piezoceramic (PZT) sensor to a printed part, the measured electrical impedance of the PZT can be directly linked to the mechanical impedance of the part. By observing deviations in the mechanical impedance of the part, as determined by this quick, non-intrusive electrical measurement, one is able to detect the existence of part defects. In this paper, the authors explore the effectiveness and sensitivity of the technique as a means for detecting of a variety of defect types and magnitudes.en_US
dc.description.departmentMechanical Engineeringen_US
dc.identifier.urihttps://hdl.handle.net/2152/89432
dc.language.isoengen_US
dc.publisherUniversity of Texas at Austinen_US
dc.relation.ispartof2015 International Solid Freeform Fabrication Symposiumen_US
dc.rights.restrictionOpenen_US
dc.subjectimpedance-based monitoringen_US
dc.subjectpart abnormalitiesen_US
dc.subjectadditive manufacturingen_US
dc.subjectquality controlen_US
dc.titleNon-Destructive Evaluation of Additively Manufactured Parts via Impedance-Based Monitoringen_US
dc.typeConference paperen_US
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