Dimensional Comparison of a Cold Spray Additive Manufacturing Simulation Tool

dc.creatorMurray, R.A.
dc.creatorFoy, G.
dc.creatorClemon, L.
dc.date.accessioned2021-11-18T17:37:19Z
dc.date.available2021-11-18T17:37:19Z
dc.date.issued2019
dc.description.abstractHigh-velocity particle spray greatly increases metal additive manufacturing deposition speed over other commercial methods. Accurate prediction and measurement of this process will improve process control. A LightSPEE3D machine fabricated symmetric copper components. On-board software predicts the build geometry (.stl) given the input geometry and the build settings. Assessment of prediction accuracy is needed to enable rapid part design and print setting optimization. White-light 3D-scanning and high-fidelity optical microscopy scans are compared to the simulation and intended 20mm cubes using hausdorf distance: 1. Control-repeated scans: 0.38±0.48mm, max:2.25mm 2. Intended-original vs. scans: 1.42±1.58mm, max:6.72mm 3. Software-predicted vs. scans: 0.44±0.66mm, max:3.97mm Discrepancies up to 6.72mm and asymmetric fabrication artifacts were identified. The reduction in the hausdorf distance for simulation vs intended-original, and larger distance of the simulation compared to control, indicate the simulation tool may enable rapid optimization given over/under spray quantification. Recommendations for reducing asymmetric fabrication artifacts and over/underspray are provided.en_US
dc.description.departmentMechanical Engineeringen_US
dc.identifier.urihttps://hdl.handle.net/2152/90441
dc.identifier.urihttp://dx.doi.org/10.26153/tsw/17362
dc.language.isoengen_US
dc.publisherUniversity of Texas at Austinen_US
dc.relation.ispartof2019 International Solid Freeform Fabrication Symposiumen_US
dc.rights.restrictionOpenen_US
dc.subjectcold sprayen_US
dc.subjectscanningen_US
dc.subjectpart inspectionen_US
dc.subjectmetal additiveen_US
dc.subjecthigh-velocity particle sprayen_US
dc.titleDimensional Comparison of a Cold Spray Additive Manufacturing Simulation Toolen_US
dc.typeConference paperen_US
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