Electromagnetic and Structural Analyses of an Integrated Launch Package

Access full-text files

Date

1999-01

Authors

Liu, H-P.
Ting, Y.L.
Zowarka, R.C.
Alexander, A.

Journal Title

Journal ISSN

Volume Title

Publisher

IEEE

Abstract

In this paper, detailed three-dimensional (3D) transient electromagnetic (EM) analyses with temperature-dependent material properties were performed using a state-of-the-art analysis tool to calculate current densities, body force densities, and temperature distribution in launch package and rail conductors. The body force densities, temperature distribution, and package accelerations generated by the EM model were then provided to a 3D multiple-step nonlinear static structural model for detailed mechanical analyses. The combined 3D EM and structural analyses can be used to accurately predict the EM launching performance and launch package structural integrity. Furthermore, armature optimization and package survivability enhancement can also be achieved with the help of these analyses

Description

LCSH Subject Headings

Citation

H-P. Liu, Y.L. Ting, R.C. Zowarka, and A. Alexander, “Electromagnetic and structural analyses of an integrated launch package,” IEEE Transactions on Magnetics, vol. 35, no. 1, January 1999, pp. 74-78.

Collections