Integration of Direct-Write (DW) and Ultrasonic Consolidation (UC) Technologies to Create Advanced Structures with Embedded Electrical Circuitry

Date
2006-09-14
Authors
Robinson, Christopher J.
Stucker, Brent
Lopes, Amit J.
Wicker, Ryan
Palmer, Jeremy A.
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Abstract

In many instances conductive traces are needed in small, compact and enclosed areas. However, with traditional manufacturing techniques, embedded electrical traces or antenna arrays have not been a possibility. By integrating Direct Write and Ultrasonic Consolidation technologies, electronic circuitry, antennas and other devices can be manufactured directly into a solid metal structure and subsequently completely enclosed. This can achieve a significant reduction in mass and volume of a complex electronic system without compromising performance.

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