Picoliter Solder Droplet Dispensing

Access full-text files

Date

1993

Authors

Marusak, Ronald E.

Journal Title

Journal ISSN

Volume Title

Publisher

Abstract

A device based on ink-jet printing technology was used to produce and place molten solder droplets, approximately 25-125pm in diameter, onto substrates. The advantages of an ink-jet based system are direct production of metallic objects, no postcure, low cost, and the repeatability and resolution for small feature sizes. This paper describes the device, the supporting hardware, and experimental procedures. Results show that bump size can be varied by placing in quick succession, multiple droplets as well as by resizing the device and by altering the signal.

Description

LCSH Subject Headings

Citation