A Study of the Electrical Resistivity of Sintered Copper Nanoparticles

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dc.creatorDibua, Obehi G
dc.creatorLiao, Aaron
dc.creatorTasnim, Farzana
dc.creatorGrose, Joshua
dc.creatorBehera, Dipankar
dc.creatorFoong, Chee S
dc.creatorCullinan, Michael
dc.date.accessioned2023-01-23T14:05:41Z
dc.date.available2023-01-23T14:05:41Z
dc.date.issued2022
dc.description.abstractMicroscale Selective Laser Sintering is a novel Additive Manufacturing process being built to fabricate parts with microscale resolution for applications in the microelectronics industry where small feature sizes are critical. This process works by sintering nanoparticles to give a better control on feature sizes. To get an idea of the mechanical strength of the parts fabricated with this process, it is important to be able to quantify the density in the manufactured parts. However, the parts fabricated with this process are too thin to physically handle enough to measure the density, but it is possible to measure the electrical resistance of these parts. So, in order to get the density of these parts, the relationship between electrical resistance and density has to be known. As such this paper presents an experimental study done on sintered copper nanoparticles to relate density to electrical resistance.en_US
dc.description.departmentMechanical Engineeringen_US
dc.identifier.urihttps://hdl.handle.net/2152/117279
dc.identifier.urihttp://dx.doi.org/10.26153/tsw/44160
dc.language.isoengen_US
dc.relation.ispartof2022 International Solid Freeform Fabrication Symposiumen_US
dc.rights.restrictionOpenen_US
dc.subjectnanoparticlesen_US
dc.titleA Study of the Electrical Resistivity of Sintered Copper Nanoparticlesen_US
dc.typeConference paperen_US

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