Si/SiC-Ceramic low process shrinkage - high temperature material for the Laser Sinter process

dc.creatorStierlen, Peter
dc.creatorSchanz, Peter
dc.creatorEyerer, Peter
dc.date.accessioned2019-02-26T20:39:02Z
dc.date.available2019-02-26T20:39:02Z
dc.date.issued1998
dc.description.abstractActual RP-systemsare very limited in producing adequate ceramic prototypes. In the presented process, the SiC..green part manufacturing bythe laser sintering process in combination with special postprocessing allows the fast production of SUSiC prototypes. A mixture of SiC powder and a reactive polymer binder system is used in the Laser Sinter process. In the following postprocessing the porous green part has to be .infiltrated with a precursor resin, carbonised and finally infiltrated withimolten silicon.•Incontrast to cold isostatic moulding or slip casting the shrinkage is very low (2-4 0/0).• Experiments with suitable materials/and process conditions were successful. This paper will show the state of and the possible further investigation into process.en_US
dc.description.departmentMechanical Engineeringen_US
dc.identifier.urihttps://hdl.handle.net/2152/73499
dc.identifier.urihttp://dx.doi.org/10.26153/tsw/649
dc.language.isoengen_US
dc.relation.ispartof1998 International Solid Freeform Fabrication Symposiumen_US
dc.rights.restrictionOpenen_US
dc.subjecthigh density ceramic structureen_US
dc.subjectcarbon binding structureen_US
dc.titleSi/SiC-Ceramic low process shrinkage - high temperature material for the Laser Sinter processen_US
dc.typeConference paperen_US

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