Thermal Conductivity Measurements of Polyamide 12

dc.creatorYuan, Mengqi
dc.creatorBourell, David
dc.creatorDiller, Tim
dc.date.accessioned2021-10-05T13:28:24Z
dc.date.available2021-10-05T13:28:24Z
dc.date.issued2011-08-17
dc.description.abstractAn important component in understanding the laser sintering process is knowledge of the thermal properties of the processed material. Thermal conductivity measurements of pure polyamide 12 were conducted based on transient plane source technology using a Hot Disk® TPS500 conductivity measurement device. Polyamide samples were packed to three different densities in nitrogen at steady state. Thermal diffusivity and conductivity were measured from 40°C to 170°C for both fresh powder and previously heated (“recycled”) powder. The fresh powder tests revealed that thermal conductivity increased linearly with temperature while for previously heated powder, more constant and higher thermal conductivity was observed as it formed a powder cake. Tests were also performed on fully dense polyamide 12 to establish a baseline. Polyamide 12 powder had a room-temperature thermal conductivity of approximately 0.1 W/mK which increased with temperature, whereas the bulk laser sintered polyamide 12 room-temperature value was 0.26 W/mK and generally decreased with increasing temperature.en_US
dc.description.departmentMechanical Engineeringen_US
dc.identifier.urihttps://hdl.handle.net/2152/88366
dc.identifier.urihttp://dx.doi.org/10.26153/tsw/15305
dc.language.isoengen_US
dc.publisherUniversity of Texas at Austinen_US
dc.relation.ispartof2011 International Solid Freeform Fabrication Symposiumen_US
dc.rights.restrictionOpenen_US
dc.subjectlaser sinteringen_US
dc.subjectthermal conductivityen_US
dc.subjectthermal diffusivityen_US
dc.subjectpolyamide 12en_US
dc.titleThermal Conductivity Measurements of Polyamide 12en_US
dc.typeConference paperen_US

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