Selectively Anodised Aluminum Foils as an Insulating Layer for Embedding Electronic Circuitry in a Metal Matrix via Ultrasonic Additive Manufacturing

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dc.creatorBournias-Varotsis, A.
dc.creatorFriel, R.J.
dc.creatorHarris, R.A.
dc.creatorEngstrom, D.
dc.date.accessioned2021-11-01T21:59:46Z
dc.date.available2021-11-01T21:59:46Z
dc.date.issued2016
dc.description.abstractUltrasonic Additive Manufacturing (UAM) is a hybrid Additive Manufacturing (AM) process that involves layer-by-layer ultrasonic welding of metal foils and periodic machining to achieve the desired shape. Prior investigative research has demonstrated the potential of UAM for the embedding of electronic circuits inside a metal matrix. In this paper, a new approach for the fabrication of an insulating layer between an aluminium (Al) matrix and embedded electronic interconnections is presented. First, an Anodic Aluminium Oxide (AAO) layer is selectively grown onto the surface of Al foils prior to bonding. The pre-treated foils are then welded onto a UAM fabricated aluminium substrate. The bonding step can be repeated for the full encapsulation of the electronic interconnections or components. This ceramic AAO insulating layer provides several advantages over the alternative organic materials used in previous works.en_US
dc.description.departmentMechanical Engineeringen_US
dc.identifier.urihttps://hdl.handle.net/2152/89771
dc.language.isoengen_US
dc.publisherUniversity of Texas at Austinen_US
dc.relation.ispartof2016 International Solid Freeform Fabrication Symposiumen_US
dc.rights.restrictionOpenen_US
dc.subjectaluminum foilsen_US
dc.subjectinsulating layeren_US
dc.subjectembedded electronic circuitsen_US
dc.subjectelectronic circuitsen_US
dc.subjectanodic aluminum oxideen_US
dc.subjectultrasonic additive manufacturingen_US
dc.titleSelectively Anodised Aluminum Foils as an Insulating Layer for Embedding Electronic Circuitry in a Metal Matrix via Ultrasonic Additive Manufacturingen_US
dc.typeConference paperen_US

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2016 International Solid Freeform Fabrication Symposium