Efforts to Reduce Part Bed Thermal Gradients During Laser Sintering Processing

dc.creatorYuan, Mengqi
dc.creatorBourell, David
dc.date.accessioned2021-10-06T22:47:31Z
dc.date.available2021-10-06T22:47:31Z
dc.date.issued2012-08-15
dc.description.abstractPart bed surface thermal gradients (x-y plane) are usually present in laser sintering (LS) fabricators. The purpose of this study was to investigate various means to reduce these thermal gradients. Several experiments were conducted using a FLIR™ infrared camera to examine the thermal profile of the part bed during the LS operation. Experiments included thermal profile characterization of the part bed with different nitrogen shielding gas flow rates, assessment of the proper experimental settings, and a temperature profile record of the part bed from the warm-up to the cool-down stage. A series of experiments were conducted using the laser as a heat source to preheat part bed surface cold spots to decrease the thermal gradients, which effect was limited by the natural low thermal conductivity of nylon 12 powder and large heat convection. Moreover, manifolds were mounted below the piston to provide warm nitrogen down draft flow during the LS operation.en_US
dc.description.departmentMechanical Engineeringen_US
dc.identifier.urihttps://hdl.handle.net/2152/88466
dc.identifier.urihttp://dx.doi.org/10.26153/tsw/15403
dc.language.isoengen_US
dc.publisherUniversity of Texas at Austinen_US
dc.relation.ispartof2012 International Solid Freeform Fabrication Symposiumen_US
dc.rights.restrictionOpenen_US
dc.subjectlaser sinteringen_US
dc.subjectpart bed thermal gradientsen_US
dc.subjectinfrared cameraen_US
dc.titleEfforts to Reduce Part Bed Thermal Gradients During Laser Sintering Processingen_US
dc.typeConference paperen_US
Files
Original bundle
Now showing 1 - 1 of 1
Loading...
Thumbnail Image
Name:
2012-73-Yuan.pdf
Size:
1.5 MB
Format:
Adobe Portable Document Format
Description:
License bundle
Now showing 1 - 1 of 1
No Thumbnail Available
Name:
license.txt
Size:
1.64 KB
Format:
Item-specific license agreed upon to submission
Description: