Topology Optimized Heat Transfer Using the Example of an Electronic Housing
Abstract
Function integration is a key issue for an efficient and economic usage of Additive
Manufacturing. An efficient heat transfer by topology optimized structures is a rarely considered
approach which will be outlined with an exemplary electronic housing which has been newly
designed. A commercial projector unit, whose electrical components in total produce 38 W, shall
be integrated in the closed housing and passively cooled by natural convection. Topology
optimized structures shall be generated in the inner part of the housing to transfer the heat
homogenously from the projector components to the housing wall while simultaneously
minimizing the mass. At the outside of the housing walls, lattice and rib structures are applied to
increase the effective surface for heat transfer by natural convection and radiation. Furthermore,
the housing geometry is optimized regarding a minimization of support structures to reduce the
post-processing effort. Finally, the housing shall be built of AlSi10Mg by SLM.