Apparatus and method for deforming a workpiece

An apparatus and method is provided for controlling the temperature of dies and workpiece throughout a deformation process. Dies are capable of receiving external current to resistively heat the workpiece and dies during the deformation operation, the external current being modulated by feedback temperature readings taken from the workpiece. External current may be provided from a homopolar generator capable of producing pulsed dc current at controllable intervals and magnitudes simultaneously through the dies and workpiece.