Reducing Warpage In Sterelothiography Through Novel Draw Styles
MetadataShow full item record
A consistent problem with stereolithography has been part distortion and dimensional inaccuracies caused by resin shrinkage. Resin shrinkage and, thus, warpage occurs during the build process and during the postcure. Build parameters such as draw pattern (the order in which strands are drawn by the laser) and overcure (cure depth minus slice thickness) can affect overall part warpage by minimizing the warpage of individual strands and layers. A software package, PATTERNDRAW, developed at the University of Dayton allows an SLA operator to manipulate vector files and change the pattern by which layers, slices, are filled in. This software was used to study the effects of draw pattelTI, vector segmentation" and cure depth on warpage of parts of different sizes. All parts were made using Ciba-Geigy 5081-1 resin. Moire analysis was used to measure out-of-plane deflections of part surfaces. Result~ indicate that significant reductions in warpage can be achieved by the use of novel draw styles.