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dc.contributor.advisorHo, P. S.en
dc.creatorWang, Guotaoen
dc.date.accessioned2008-08-28T22:31:59Zen
dc.date.available2008-08-28T22:31:59Zen
dc.date.issued2004en
dc.identifierb60817550en
dc.identifier.urihttp://hdl.handle.net/2152/2082en
dc.descriptiontexten
dc.format.mediumelectronicen
dc.language.isoengen
dc.rightsCopyright is held by the author. Presentation of this material on the Libraries' web site by University Libraries, The University of Texas at Austin was made possible under a limited license grant from the author who has retained all copyrights in the works.en
dc.subject.lcshElectronic packaging--Materialsen
dc.subject.lcshCopperen
dc.subject.lcshSemiconductors--Junctionsen
dc.titleThermal deformation of electronic packages and packaging effect on reliability for copper/low-k interconnect structuresen
dc.description.departmentMaterials Science and Engineeringen
dc.identifier.oclc68813299en
dc.identifier.proqst3145875en
dc.type.genreThesisen
thesis.degree.departmentMaterials Science and Engineeringen
thesis.degree.disciplineMaterials Science and Engineeringen
thesis.degree.grantorThe University of Texas at Austinen
thesis.degree.levelDoctoralen
thesis.degree.nameDoctor of Philosophyen


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