In 3-D interconnect structures, process-induced thermal stresses around through silicon vias (TSVs) raise serious reliability issues such as silicon cracking and performance degradation of devices. In this study, the ...

A diverse spectrum of technology drivers such as improved thermal barriers, higher efficiency thermoelectric energy conversion, phase-change memory, heat-assisted magnetic recording, thermal management of nanoscale ...

A new method for seeding the modulation instability (MI) within an SPS-LHC proton beam using a laser pulse is presented. Using simulations, we show that a laser pulse placed ahead of a proton beam excites axially symmetric ...

Compact near-field solid-state accelerating structure powered by a carbon dioxide (CO(2)) laser is considered. The accelerating luminous transverse magnetic mode is excited in a few-micron wide evacuated planar channel ...

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We report guiding of intense (I = 1.3 +/- 0.7 x 10(17)W/cm(2)) 80 fs laser pulses with negligible spectral distortion through 1.5-cm-long preformed helium plasma channels. Channels were formed by axicon-focused Nd:YAG laser ...