Now showing items 81-86 of 86
Thermal Stresses Analysis Of 3-D Interconnect
In 3-D interconnect structures, process-induced thermal stresses around through silicon vias (TSVs) raise serious reliability issues such as silicon cracking and performance degradation of devices. In this study, the ...
Nanoscale Thermal Transport. II. 2003-2012
A diverse spectrum of technology drivers such as improved thermal barriers, higher efficiency thermoelectric energy conversion, phase-change memory, heat-assisted magnetic recording, thermal management of nanoscale ...
Laser-Seeded Modulation Instability Within LHC Proton Beams
A new method for seeding the modulation instability (MI) within an SPS-LHC proton beam using a laser pulse is presented. Using simulations, we show that a laser pulse placed ahead of a proton beam excites axially symmetric ...
Surface Wave Accelerator Based On Silicon Carbide: Theoretical Study
Compact near-field solid-state accelerating structure powered by a carbon dioxide (CO(2)) laser is considered. The accelerating luminous transverse magnetic mode is excited in a few-micron wide evacuated planar channel ...
Production And Characterization Of A Fully-Ionized He Plasma Channel
We report guiding of intense (I = 1.3 +/- 0.7 x 10(17)W/cm(2)) 80 fs laser pulses with negligible spectral distortion through 1.5-cm-long preformed helium plasma channels. Channels were formed by axicon-focused Nd:YAG laser ...