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dc.contributor.advisorHo, P. S.en
dc.creatorRhee, Seung-hyunen
dc.date.accessioned2011-04-04T14:51:04Zen
dc.date.available2011-04-04T14:51:04Zen
dc.date.created2001-08en
dc.date.issued2011-04-04en
dc.identifier.urihttp://hdl.handle.net/2152/10811en
dc.descriptiontexten
dc.description.abstractNot availableen
dc.format.mediumelectronicen
dc.language.isoengen
dc.rightsCopyright is held by the author. Presentation of this material on the Libraries' web site by University Libraries, The University of Texas at Austin was made possible under a limited license grant from the author who has retained all copyrights in the works.en
dc.subjectSemiconductorsen
dc.subjectIntegrated circuitsen
dc.subjectSystem failures (Engineering)en
dc.titleThermal stress behaviors of Al(Cu)/low-k and Cu/low-k submicron interconnect structuresen
dc.description.departmentMaterials Science and Engineeringen
thesis.degree.departmentMaterials Science and Engineeringen
thesis.degree.disciplineMaterials Science and Engineeringen
thesis.degree.grantorThe University of Texas at Austinen
thesis.degree.levelDoctoralen
thesis.degree.nameDoctor of Philosophyen
dc.rights.restrictionRestricteden


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