Browsing by Subject "Extrusion"
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(2015-03-20)This dissertation discusses preparation and transport property characterization of sulfonated polysulfone desalination membranes by melt processing. One route to melt processing of high glass transition temperature ...
The scaling and microstructure effects on the thermal stress and reliability of through-silicon vias in 3D integrated circuits Through-silicon vias (TSVs) enable full three-dimensional integration by providing high-density vertical interconnections, improving device bandwidth and power consumption. However, TSVs pose reliability risks due to the ...