Browsing by Subject "direct-write"

Now showing 1 - 2 of 2

Hybrid Manufacturing: Integrating Direct Write and Stereolithography
(2005-08-23) Medina, Frank; Lopes, Amit; Inamdar, Asim; Hennessey, Robert; Palmer, Jeremy; Chavez, Bart; Davis, Don; Gallegos, Phil; Wicker, Ryan
A commercial stereolithography (SL) machine was modified to integrate fluid dispensing or direct-write (DW) technology with SL in an integrated manufacturing environment for automated and efficient hybrid manufacturing of complex electrical devices, combining threedimensional (3D) electrical circuitry with SL-manufactured parts. The modified SL system operates similarly to a commercially available machine, although build interrupts were used to stop and start the SL build while depositing fluid using the DW system. An additional linear encoder was attached to the SL platform z-stage and used to maintain accurate part registration during the SL and DW build processes. Individual STL files were required as part of the manufacturing process plan. The DW system employed a three-axis translation mechanism that was integrated with the commercial SL machine. Registration between the SL part, SL laser and the DW nozzle was maintained through the use of 0.025-inch diameter cylindrical reference holes manufactured in the part during SL. After depositing conductive ink using DW, the SL laser was commanded to trace the profile until the ink was cured. The current system allows for easy exchange between SL and DW in order to manufacture fully functional 3D electrical circuits and structures in a semi-automated environment. To demonstrate the manufacturing capabilities, the hybrid SL/DW setup was used to make a simple multi-layer SL part with embedded circuitry. This hybrid system is not intended to function as a commercial system, it is intended for experimental demonstration only. This hybrid SL/DW system has the potential for manufacturing fully functional electromechanical devices that are more compact, less expensive, and more reliable than their conventional predecessors, and work is ongoing in order to fully automate the current system.
Three-Dimensional Off-Axis Component Placement and Routing for Electronics Integration using Solid Freeform Fabrication
(2008-09-10) DeNava, Erick; Navarrete, Misael; Lopes, Amit; Alawneh, Mohammed; Contreras, Marlene; Muse, Dan; Castillo, Silvia; MacDonald, Eric
Traditional placement of transistors in chips and components on printed circuit boards has been constrained in two dimensions. Routing of electrical signals in these devices has been extended to two and half dimensions by virtue of additional routing layers which are connected through vertical vias (i.e. four layer printed circuit boards or CMOS chips with seven layers of metal routing); however, truly three-dimensional off-axis component placement and routing have not yet been explored. Solid freeform fabrication provides the means of creating a dielectric substrate suitable for these electronics with sockets for components and channels for interconnect. Direct write dispensing of conductive inks or epoxies into these channels has been reported previously for electronics applications, but was generally confined to two dimensions in a fashion similar to traditional electronics. The current research describes a demonstration prototype in which components are placed off-axis to fulfill application requirements (for a three-dimensional magnetic flux sensor system) and where sections are routed off-axis as well – all of which provides new levels of design freedom for the implementation of electronics systems.