Browsing by Subject "Fiber Encapsulation Additive Manufacturing"

Now showing 1 - 2 of 2

Active Device Fabrication Using Fiber Encapsulation Additive Manufacturing
(University of Texas at Austin, 2015) Saari, M.; Galla, M.; Cox, B.; Richer, E.; Krueger, P.; Cohen, A.
Fiber Encapsulation Additive Manufacturing (FEAM) is a novel solid freeform fabrication process in which a fiber and a matrix are co-deposited simultaneously within a single printer along straight and curved 2-D and 3-D paths. Using a FEAM approach in which the fiber is a metal wire and the matrix is a thermoplastic polymer, simple electromechanical devices such as voice coils, inductive sensors, and membrane switches have been successfully produced. This paper will present an overview of the FEAM process, describe several fabricated devices, and discuss recent developments in controllably stopping and starting the wire, and in creating electrical junctions between individual wires, which together enable much more complex devices to be made.
Fiber Encapsulation Additive Manufacturing: Materials for Electrical Junction Fabrication
(University of Texas at Austin, 2016) Xia, B.; Saari, M.; Cox, B.; Richer, E.; Krueger, P.S.; Cohen, A.L.
Fiber Encapsulation Additive Manufacturing (FEAM) is a novel 3-D printing process that permits the printing of electromechanical and electronic devices within a single, affordable machine. A key challenge of FEAM is creating robust and reliable electrical junctions between encapsulated wires, enabling more complex devices and circuits to be fabricated. We present current efforts to explore and characterize several different methods for creating junctions: solder, solder paste, and a custom-formulated electrically conductive polymer composite. All three methods are analyzed in terms of printability, material compatibility, repeatability, and performance.