Analysis of electromigration in single- and dual-inlaid Cu interconnects
| Title: | Analysis of electromigration in single- and dual-inlaid Cu interconnects |
| Author: | Justison, Patrick Ryan |
| Abstract: | Not available |
| Department: | Materials Science and Engineering |
| Subject: |
Electrodiffusion
Copper--Industrial applications |
| URI: | http://hdl.handle.net/2152/685 |
| Date: | 2003 |
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