Analysis of electromigration in single- and dual-inlaid Cu interconnects

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Analysis of electromigration in single- and dual-inlaid Cu interconnects

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Title: Analysis of electromigration in single- and dual-inlaid Cu interconnects
Author: Justison, Patrick Ryan
Abstract: Not available
Department: Materials Science and Engineering
Subject: Electrodiffusion Copper--Industrial applications
URI: http://hdl.handle.net/2152/685
Date: 2003

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