Reliability study on the via of dual damascene Cu interconnects

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Reliability study on the via of dual damascene Cu interconnects

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Title: Reliability study on the via of dual damascene Cu interconnects
Author: Baek, Won-chong
Abstract: Not available
Department: Materials Science and Engineering
Subject: Interconnects (Integrated circuit technology) Copper--Industrial applications
URI: http://hdl.handle.net/2152/2656
Date: 2006

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