Thermal stress behaviors of Al(Cu)/low-k and Cu/low-k submicron interconnect structures

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dc.contributor.advisor	Ho, P. S.
dc.creator	Rhee, Seung-hyun
dc.date.accessioned	2011-04-04T14:51:04Z
dc.date.available	2011-04-04T14:51:04Z
dc.date.created	2001-08
dc.date.issued	2011-04-04
dc.identifier.uri	http://hdl.handle.net/2152/10811
dc.description.abstract	Not available
dc.format.medium	electronic
dc.language.iso	eng
dc.rights	Copyright © is held by the author. Presentation of this material on the Libraries' web site by University Libraries, The University of Texas at Austin was made possible under a limited license grant from the author who has retained all copyrights in the works.
dc.subject	Semiconductors
dc.subject	Integrated circuits
dc.subject	System failures (Engineering)
dc.title	Thermal stress behaviors of Al(Cu)/low-k and Cu/low-k submicron interconnect structures
dc.description.department	Materials Science and Engineering
dc.type.genre	Thesis
dc.type.material	text
thesis.degree.department	Materials Science and Engineering
thesis.degree.discipline	Materials Science and Engineering
thesis.degree.grantor	The University of Texas at Austin
thesis.degree.level	Doctoral
thesis.degree.name	Doctor of Philosophy
dc.rights.restriction	Restricted