Thermal stress behaviors of Al(Cu)/low-k and Cu/low-k submicron interconnect structures

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Thermal stress behaviors of Al(Cu)/low-k and Cu/low-k submicron interconnect structures

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dc.contributor.advisor Ho, P. S.
dc.creator Rhee, Seung-hyun
dc.date.accessioned 2011-04-04T14:51:04Z
dc.date.available 2011-04-04T14:51:04Z
dc.date.created 2001-08
dc.date.issued 2011-04-04
dc.identifier.uri http://hdl.handle.net/2152/10811
dc.description.abstract Not available
dc.format.medium electronic
dc.language.iso eng
dc.rights Copyright © is held by the author. Presentation of this material on the Libraries' web site by University Libraries, The University of Texas at Austin was made possible under a limited license grant from the author who has retained all copyrights in the works.
dc.subject Semiconductors
dc.subject Integrated circuits
dc.subject System failures (Engineering)
dc.title Thermal stress behaviors of Al(Cu)/low-k and Cu/low-k submicron interconnect structures
dc.description.department Materials Science and Engineering
dc.type.genre Thesis
dc.type.material text
thesis.degree.department Materials Science and Engineering
thesis.degree.discipline Materials Science and Engineering
thesis.degree.grantor The University of Texas at Austin
thesis.degree.level Doctoral
thesis.degree.name Doctor of Philosophy
dc.rights.restriction Restricted

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