Thermal stress behaviors of Al(Cu)/low-k and Cu/low-k submicron interconnect structures

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Thermal stress behaviors of Al(Cu)/low-k and Cu/low-k submicron interconnect structures

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Title: Thermal stress behaviors of Al(Cu)/low-k and Cu/low-k submicron interconnect structures
Author: Rhee, Seung-hyun
Abstract: Not available
Department: Materials Science and Engineering
Subject: Semiconductors Integrated circuits System failures (Engineering)
URI: http://hdl.handle.net/2152/10811
Date: 2001-08

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