Thermal stress behaviors of Al(Cu)/low-k and Cu/low-k submicron interconnect structures
| Title: | Thermal stress behaviors of Al(Cu)/low-k and Cu/low-k submicron interconnect structures |
| Author: | Rhee, Seung-hyun |
| Abstract: | Not available |
| Department: | Materials Science and Engineering |
| Subject: |
Semiconductors
Integrated circuits System failures (Engineering) |
| URI: | http://hdl.handle.net/2152/10811 |
| Date: | 2001-08 |
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